A.  Published Books and Parts of Books

1.       Henderson, C.L.; Lucas, K.; Strojwas, A.J. “Optical Lithography,” Encyclopedia of Electrical and Electronics Engineering, John Wiley & Sons, Inc., pp. 300-320, (1999).

2.       Lucas, K.; Postnikov, S.; Henderson, C.L.; Hector, S. “Lithography: Concepts, Challenges and Prospects,” Elsevier Science, Nano & Giga Challenges in Microelectronics, Edited by J. Greer, A. Korkin, J. Labanowski, Elsevier Science, Amsterdam, (2003).

 

B.  Refereed Publications

Published or Accepted for Publication

  1. Lawson, Richard A.; Lee, Cheng-Tsung; Henderson, Clifford L.; Whetsell, Robert; Tolbert, Laren; Wang, Yueh.   “Influence of solubility switching mechanism on resist performance in molecular glass resists,”    Journal of Vacuum Science & Technology, B: Microelectronics and Nanometer Structures--Processing, Measurement, and Phenomena,  25(6), pp. 2140-2144, (2007).
  2. Lee, Cheng-Tsung; Henderson, Clifford L.; Wang, Mingxing; Gonsalves, Kenneth E.; Wang, Yueh.   “Effects of photoacid generator incorporation into the polymer main chain on 193 nm chemically amplified resist behavior and lithographic performance,”    Journal of Vacuum Science & Technology, B: Microelectronics and Nanometer Structures--Processing, Measurement, and Phenomena,  25(6), pp. 2136-2139, (2007).
  3. Sinha, Ashwini; Hess, Dennis W.; Henderson, Clifford L..   “Transport behavior of atomic layer deposition precursors through polymer masking layers: Influence on area selective atomic layer deposition,”    Journal of Vacuum Science & Technology, B: Microelectronics and Nanometer Structures--Processing, Measurement, and Phenomena,  25(5), pp. 1721-1728, (2007).
  4. Hua, Yueming; Saxena, Shubham; Henderson, Clifford L.; King, William P.   “Nanoscale thermal lithography by local polymer decomposition using a heated atomic force microscope cantilever tip,”   Journal of Micro/Nanolithography, MEMS, and MOEMS,  6(2), pp. 023012/1-023012/6, (2007).
  5. Lee, Cheng-Tsung; Wang, Yueh; Roberts, Jeanette; Henderson, Clifford L..   “A Simple Method for Measurement of Photoacid Generator Photoreaction Kinetics in Formulated, Chemically Amplified Photoresist Films,”    Electrochemical and Solid-State Letters,  10(9), pp. H273-H277, (2007).
  6. Wang, Guoan; Romeo, Michael; Henderson, Cliff; Papapolymerou, John.   “Novel reliable RF capacitive MEMS switches with photodefinable metal-oxide dielectrics,”    Journal of Microelectromechanical Systems,  16(3), pp. 550-555, (2007).
  7. Sinha, A.; Henderson, C. L.; Hess, D. W.   “Area selective atomic layer deposition of titanium dioxide,”   ECS Transactions,  3(15, Atomic Layer Deposition Applications 2),  pp. 233-241, (2007).
  8. Sinha, Ashwini; Hess, Dennis W.; Henderson, Clifford L..   “Area selective atomic layer deposition of titanium dioxide: effect of precursor chemistry,”    Journal of Vacuum Science & Technology, B: Microelectronics and Nanometer Structures--Processing, Measurement, and Phenomena,  24(6), pp. 2523-2532, (2006).
  9. Sinha, Ashwini; Hess, Dennis W.; Henderson, Clifford L..   “A top surface imaging method using area selective ALD on chemically amplified polymer photoresist films.,”   Electrochemical and Solid-State Letters,  9(11),  pp. G330-G333, (2006).
  10. Wang, Mingxing; Jarnagin, Nathan D.; Lee, Cheng-Tsung; Henderson, Clifford L.; Wang, Yueh; Roberts, Jeanette M.; Gonsalves, Kenneth E.   “Novel polymeric anionic photoacid generators (PAGs) and corresponding polymers for 193 nm lithography,”    Journal of Materials Chemistry,  16(37), pp. 3701-3707, (2006).
  11. White, Celesta E.; Balogun, Abimbola; Henderson, Clifford L..   “Effects of the photoacid generator type on the imaging and thermal decomposition properties of photodefinable, thermally sacrificial poly(propylene carbonate) materials.,”   Journal of Applied Polymer Science,  102(1),  pp. 266-271, (2006).
  12. Sinha, Ashwini; Hess, Dennis W.; Henderson, Clifford L..   “Area-Selective ALD of Titanium Dioxide Using Lithographically Defined Poly(methyl methacrylate) Films,”    Journal of the Electrochemical Society,  153(5), pp. G465-G469, (2006).
  13. Lillie, Jeffrey J.; Thomas, Mikkel A.; Jokerst, Nan-Marie; Ralph, Stephen E.; Dennis, Karla A.; Henderson, Clifford L..   “Multimode interferometric sensors on silicon optimized for fully integrated complementary-metal-oxide-semiconductor chemical-biological sensor systems,”   Journal of the Optical Society of America B: Optical Physics,  23(4),  pp. 642-651, (2006).
  14. Slopek, Ryan P.; McKinley, Haris K.; Henderson, Clifford L.; Breedveld, Victor.   “In situ monitoring of mechanical properties during photopolymerization with particle tracking microrheology,”  Polymer,  47(7),  pp. 2263-2268, (2006).
  15. Yamanaka, Kazuhiro; Romeo, Michael; Maeda, Kazuhiko; Henderson, Clifford L..   “Novel low-dielectric constant photodefinable polyimides for low-temperature polymer processing.,”   ECS Transactions,  3(11, Science and Technology of Dielectrics for Active and Passive Photonic Devices),  pp. 107-115, (2006).
  16. Hua, Yueming; Henderson, Clifford L..   “Photodefinable thermally sacrificial polycarbonate materials and methods for MEMS and microfluidic device fabrication.”    ECS Transactions,  3(10, Chemical Sensors 7 and MEMS/NEMS 7), pp. 389-397, (2006).
  17. Romeo, Michael; Wang, Guoan; Papapolymerou, John; Henderson, Clifford L..   “MEMS capacitive switch fabrication using photodefinable metal oxide dielectrics,”    ECS Transactions,  3(10, Chemical Sensors 7 and MEMS/NEMS 7), pp. 367-374, (2006).
  18. Cannon, Andrew H.; Hua, Yueming; Henderson, Clifford L.; King, William P.   “Self-assembly for three-dimensional integration of functional electrical components,”    Journal of Micromechanics and Microengineering,  15(11),  pp. 2172-2178, (2005).
  19. McCoy, Kendra; Hess, Dennis W.; Henderson, Clifford L.; Tolbert, Laren M.   “Patterning via surface monolayer initiated polymerization: A study of surface initiator photoreaction kinetics,”    Journal of Vacuum Science & Technology, B: Microelectronics and Nanometer Structures--Processing, Measurement, and Phenomena,  22(6), pp. 3503-3508, (2004).
  20. Barstow, Sean J.; Jeyakumar, Augustin; Roman, Paul J., Jr.; Henderson, Clifford L..  “Direct Photopatterning of Metal Oxide Structures Using Photosensitive Metallorganics,”  Journal of the Electrochemical Society,  151(10),  pp. F235-F241, (2004).
  21. Tang, Yanyan; Henderson, Cliff; Muzzy, John; Rosen, David W.  “Stereolithography cure modelling and simulation,”  International Journal of Materials & Product Technology,  21(4),  pp. 255-272, (2004).
  22. Berger, Cody M.; Henderson, Clifford L..  “Improved method for measuring photoacid generator kinetics in polymer thin films using normalized interdigitated electrode capacitance data.”    Journal of Vacuum Science & Technology, B: Microelectronics and Nanometer Structures--Processing, Measurement, and Phenomena,  22(3),  pp. 1163-1173, (2004).
  23. Henderson, Clifford L.; King, William P.; White, Celesta E.; Rowland, Harry R.  “Microsystems manufacturing via embossing of thermally sacrificial polymers,”  Materials Research Society Symposium Proceedings,  EXS-2(Nontraditional Approaches to Patterning),  pp. 17-19, (2004).
  24. Singh, Lovejeet; Ludovice, Peter J.; Henderson, Clifford L..  “Effect of thin film confinement on the transport properties of ultra-thin polymer films.”  Materials Research Society Symposium Proceedings,  790(Dynamics in Small Confining Systems--2003),  203-208, (2004).
  25. Hoskins, Trevor; Chung, Won Jae; Agrawal, Ankur; Ludovice, Peter J.; Henderson, Clifford L.; Seger, Larry D.; Rhodes, Larry F.; Shick, Robert A.  “Bis(trifluoromethyl)carbinol-Substituted Polynorbornenes: Dissolution Behavior,”  Macromolecules,  37(12),  pp. 4512-4518, (2004).
  26. Wang, Guoan; Jeyakumar, Augustin; Papapolymerou, John; Henderson, Clifford L..  “Photodefinable metal oxide dielectrics: A novel method for fabricating low cost RF capacitive MEMS switches,”  Materials Research Society Symposium Proceedings,  783, pp. 91-96, (2004).
  27. Singh, Lovejeet; Ludovice, Peter J.; Henderson, Clifford L..  “Influence of molecular weight and film thickness on the glass transition temperature and coefficient of thermal expansion of supported ultrathin polymer films,”  Thin Solid Films,  449(1,2),  pp. 231-241, (2004).
  28. Berger, Cody M.; Byers, Jeffrey D.; Henderson, Clifford L..  “Using Interdigitated Electrodes for Measuring Photoacid Generator Kinetics in Chemically Amplified Resists,”  Journal of the Electrochemical Society,  151(2),  pp. G119-G130, (2004).
  29. Jeyakumar, Augustin; Henderson, Clifford L.; Roman, Paul, Jr.; Suh, Seigi.  “Electron beam lithography process using radiation sensitive carboxylate metalorganic precursors,”    Journal of Vacuum Science & Technology, B: Microelectronics and Nanometer Structures--Processing, Measurement, and Phenomena,  21(6),  pp. 3157-3161, (2003).
  30. White, Celesta E.; Henderson, Clifford L..  “Development of improved photosensitive polycarbonate systems for the fabrication of microfluidic devices,”  Journal of Vacuum Science & Technology, B: Microelectronics and Nanometer Structures--Processing, Measurement, and Phenomena,  21(6),  pp. 2926-2930, (2003).
  31. Mukherjee, Shyama P.; Roman, Paul J., Jr.; Madsen, Harold O.; Svendsen, Leo G.; Fury, Michael A.; Barstow, Sean J.; Jeykumar, Augustin; Henderson, Clifford L..  “High dielectric constant metal oxide films via photochemical metal organic deposition (PMOD) process.”  Proceedings - Electrochemical Society,  Volume Date 2002,  2002-28(Physics and Technology of High-k Gate Dielectrics I),  pp. 263-275, (2003).
  32. Berger, C.M.; Henderson, C.L.  “The effect of humidity on water sorption in photoresist polymer thin films,”    Polymer, 44(7),  pp. 2101-2108, (2003).
  33. Wang, G.; Barstow, S.; Jeyakumar, A.; Papapolymerou; Henderson, C.L.  “Low Cost RF MEMS Switches Using Photodefinable Mixed Oxide Dielectrics,” 2003 IEEE International Microwave Symposium Digest, 3, pp. 1633-1636, (2003).
  34. Ali, A.M.; Gonsalves, K.E.; Jeyakumar, A.; Agrawal, A.; Henderson, C.L.  “A new nanocomposite resist for low and high voltage electron beam lithography,” Microelectronics Engineering, 70(1), 19-29, (2003).
  35. Jayachandran, J.P.; Reed, H.A.; Zhen, H.; Rhodes, L.F.; Henderson, C.L.; Bidstrup Allen, S.A.; Kohl, P.A.  “Air-channel fabrication for microelectromechanical systems via sacrificial photosensitive polycarbonates,” Journal of Microelectromechanical Systems, 12(2), pp. 147-159, (2003).
  36. Liu, T.; Henderson, C.L.; Samuels, R.  “Quantitative characterization of the optical properties of absorbing polymer films: Comparative investigation of the internal reflection intensity analysis method,” Journal of Polymer Science, Part B: Polymer Physics, 41(8), pp. 842-855, (2003).
  37. Wu, X.; Reed, H.A.; Rhodes, L.F.; Elce, E.; Ravikiran, R.; Shick, R.A.; Henderson, C.L.; Bidstrup Allen, S.A.; Kohl, P.A.  “Photoinitiation systems and thermal decomposition of photodefinable sacrificial materials,” Journal of Applied Polymer Science, 88(5), pp. 1186-1195, (2003).
  38. Wu, X.; Reed, H.A.; Wang, Y.; Rhodes, L.F.; Elce, E.; Ravikiran, R.; Shick, R.A.; Henderson, C.L.; Bidstrup Allen, S.A.; Kohl, P.A.  “Fabrication of Microchannels using Polynorbornene Photosensitive Sacrificial Materials,” Journal of the Electrochemical Society, 150(9), pp. H205-H213, (2003).
  39. Wu, X.; Reed, H.A.; Rhodes, L.F.; Elce, E.; Ravikiran, R.; Shick, R.A.; Henderson, C.L.; Bidstrup Allen, S.A.; Kohl, P.A.  “Lithographic Characteristics and Thermal Processing of Photosensitive Sacrificial Materials,”    Journal of the Electrochemical Society, 149(10), pp. G555-G561, (2002).
  40. Henderson, C.L.; Barstow, S.; Jeyakumar, A.; McCoy, K.; Hess, D.W.; Tolbert, L.M.  “Novel approaches to nanopatterning: From surface monolayer initiated polymerization to hybrid organometallic-organic bilayers,” Materials Research Society Symposium Proceedings, 705(Nanopatterning: From Ultralarge-Scale Integration to Biotechnology), pp. 3-14, (2002).
  41. Reed, H.A.; White, C.E.; Rao, V.; Bidstrup Allen, S.A.; Henderson, Clifford L.; Kohl, Paul A.  “Fabrication of microchannels using polycarbonates as sacrificial materials,” Journal of Micromechanics and Microengineering, 11(6), pp. 733-737, (2001). 
  42. Chen, Xiaohua; Tolbert, Laren M.; Henderson, Clifford L.; Hess, Dennis W.; Ruhe, Jurgen.  “Polymer pattern formation on SiO2 surfaces using surface monolayer initiated polymerization,” Journal of Vacuum Science & Technology, B: Microelectronics and Nanometer Structures, 19(6), pp. 2013-2019, (2001).
  43. Erdmann, A.; Henderson, C.L.; Willson, C.G., “Impact of exposure induced refractive index changes of photoresists on the photolithographic process,” Journal of Applied Physics, 89(12),  pp. 8163-8168, (2001).
  44. Chen, Xiaohua; Tolbert, Laren M.; Hess, Dennis W.; Henderson, Cliff.  “A Bergman Cyclization Approach to Polymers for Thin-Film Lithography,” Macromolecules, 34(12), pp. 4104-4108, (2001).
  45. Forney, L.J.; Henderson, C.L.  “Electrochemical membranes: transport limitations for absorbed gases,” Journal of Applied Electrochemistry, 28(4), pp. 423-431, (1998).   
  46. P.C. Tsiartas, L.W. Flanagin, C.L. Henderson, W.D. Hinsberg, I.C. Sanchez, R.T. Bonnecaze, C.G. Willson, "The Mechanism of Phenolic Polymer Dissolution: A New Perspective," Macromolecules, 30, pp. 4656-4664, (1997).

 

C.  Other Publications

  1. Lawson, Richard A.; Lee, Cheng-Tsung; Whetsell, Robert; Yueh, Wang; Roberts, Jeanette; Tolbert, Laren; Henderson, Clifford L..   “Molecular glass photoresists containing photoacid generator functionality: A route to a single-molecule photoresist,”    Proceedings of SPIE-The International Society for Optical Engineering,  6519(Pt. 1, Advances in Resist Materials and Processing Technology XXIV), pp. 65191N/1-65191N/10, (2007).
  2. Romeo, Michael; Yamanaka, Kazuhiro; Maeda, Kazuhiko; Henderson, Clifford L..   “Novel photodefinable low-k dielectric polymers based on polybenzoxazines,”    Proceedings of SPIE-The International Society for Optical Engineering,  6519(Pt. 1, Advances in Resist Materials and Processing Technology XXIV), pp. 65191K/1-65191K/7, (2007).
  3. Sinha, Ashwini; Hess, Dennis W.; Henderson, Clifford L..   “A novel top surface imaging approach utilizing direct-area selective atomic layer deposition of hardmasks,”    Proceedings of SPIE-The International Society for Optical Engineering,  6519(Pt. 1, Advances in Resist Materials and Processing Technology XXIV), pp. 65191J/1-65191J/10, (2007).
  4. Wang, Mingxing; Lee, Cheng-Tsung; Henderson, Clifford L.; Wang, Yueh; Roberts, Jeanette M.; Gonsalves, Kenneth E.   “Novel anionic photoacid generator (PAGs) and photoresist for sub-50-nm patterning by EUVL and EBL,”   Proceedings of SPIE-The International Society for Optical Engineering,  6519(Pt. 1, Advances in Resist Materials and Processing Technology XXIV), pp. 65191F/1-65191F/6, (2007).
  5. Lee, Cheng-Tsung; Wang, Mingxing; Jarnagin, Nathan D.; Gonsalves, Kenneth E.; Roberts, Jeanette M.; Wang, Yueh; Henderson, Clifford L..   “Photosensitivity and line-edge roughness of novel polymer-bound PAG photoresists,”    Proceedings of SPIE-The International Society for Optical Engineering,  6519(Pt. 1, Advances in Resist Materials and Processing Technology XXIV), pp. 65191E/1-65191E/9, (2007).
  6. Hua, Yueming; Saxena, Shubham; Lee, Jung C.; King, William P.; Henderson, Clifford L..  “Direct three-dimensional nanoscale thermal lithography at high speeds using heated atomic-force microscope cantilevers,”    Proceedings of SPIE-The International Society for Optical Engineering,  6517(Pt. 1, Emerging Lithographic Technologies XI), pp. 65171L/1-65171L/6, (2007).
  7. Yamanaka, Kazuhiro; Romeo, Michael; Maeda, Kazuhiko; Henderson, Clifford L..   “Novel low-dielectric constant photodefinable polyimides for low-temperature polymer processing,”    Proceedings of SPIE-The International Society for Optical Engineering,  6153(Pt. 1, Advances in Resist Technology and Processing XXIII),  pp. 61531H/1-61531H/11, (2006).
  8. Hua, Yueming; Saxena, Shubham; King, William P.; Henderson, Clifford L..   “Nanolithography in thermally sacrificial polymers using nanoscale thermal probes,”    Proceedings of SPIE-The International Society for Optical Engineering,  6153(Pt. 1, Advances in Resist Technology and Processing XXIII), pp. 61531G/1-61531G/7, (2006).
  9. Lee, Cheng-Tsung; Jarnagin, Nathan D.; Wang, Mingxing; Gonsalves, Kenneth E.; Robert, Jeanette M.; Wang, Yueh; Henderson, Clifford L..   “Fundamental studies of the properties of photoresists based on resins containing polymer-bound photoacid generators,”    Proceedings of SPIE-The International Society for Optical Engineering,  6153(Pt. 2, Advances in Resist Technology and Processing XXIII), pp. 61532E/1-61532E/11, (2006).
  10. Sinha, Ashwini; Hess, Dennis W.; Henderson, Clifford L..   “Lithography via top surface imaging using area selective atomic layer deposition,”    AIChE Annual Meeting, Conference Proceedings, San Francisco, CA, United States, Nov. 12-17, 2006, pp. 685g/1-685g/2, (2006).
  11. King, William P.; Henderson, Clifford L.; Nelson, Brent A.; Saxena, Shubham; Hua, Yueming; Laracuente, Arnaldo; Sheehan, Paul A.; Whitman, Lloyd; Yang, Minchul.   “Nanoelectronics writing using heated probe tips,”    PMSE Preprints,  94, pp. 869, (2006).
  12. Callander, Derrick; Singh, Lovejeet; Hoskins, Trevor; Chung, Won Jae; Henderson, Clifford; Ludovice, Peter.   “Elucidation of structure-property relationships in polymers for microelectronics using computer simulation,”    PMSE Preprints,  94, pp. 866-868, (2006).
  13. Hua, Yueming; Henderson, Clifford L..   “Photodefinable thermally sacrificial polymers and processes for microelectronics and MEMS fabrication,”    PMSE Preprints,  94, pp. 825-826, (2006).
  14. Sinha, Ashwini; Jeyakumar, Augustin; Hess, Dennis W.; Henderson, Clifford L..  “New fabrication methods for forming patterned metal oxide micro- and nanostructures,”    Proceedings of the World Congress of Chemical Engineering, 7th, Glasgow, United Kingdom, July 10-14, 2005, pp. 86471/1-86471/10, (2005).
  15. Comeau, Benita M.; Umar, Yusif; Gonsalves, Kenneth E.; Henderson, Clifford L..   “New materials and methods for hierarchically structured tissue scaffolds,”    Proceedings of the World Congress of Chemical Engineering, 7th, Glasgow, United Kingdom, July 10-14, 2005, pp. 86457/1-86457/10, (2005).
  16. Berger, Cody; Henderson, Clifford L..   “Effect of film composition on the performance of interdigitated electrode methods used for chemically amplified photoresist characterization: methods for analyzing photoresist materials containing base quencher,”    Proceedings of SPIE-The International Society for Optical Engineering,  5753(Pt. 2, Advances in Resist Technology and Processing XXII), pp. 1076-1087, (2005).
  17. Singh, Lovejeet; Henderson, Clifford L.; Ludovice, Peter J.   “Characterization of property variation in ultra-thin polymer films from molecular simulation,”    Proceedings of SPIE-The International Society for Optical Engineering,  5753(Pt. 2, Advances in Resist Technology and Processing XXII), pp. 1202-1211, (2005).
  18. Singh, Lovejeet; Ludovice, Peter J.; Henderson, Clifford L..   “The effect of film thickness on the dissolution rate and hydrogen bonding behavior of photoresist polymer thin films,”    Proceedings of SPIE-The International Society for Optical Engineering,  5753(Pt. 1, Advances in Resist Technology and Processing XXII), pp. 319-328, (2005).
  19. Gonsalves, Kenneth E.; Thiyagarajan, Muthiah; Dean, Kim; Santiago, Patricia; Rendon, L.; Jeyakumar, Augustin; Henderson, Clifford L..   “Material design and evaluation of nanocomposite resist for next generation lithography,”    Proceedings of SPIE-The International Society for Optical Engineering,  5753(Pt. 1, Advances in Resist Technology and Processing XXII), pp. 467-475, (2005).
  20. Sinha, Ashwini; Hess, Dennis W.; Henderson, Clifford L..   “Area selective atomic layer deposition: use of lithographically defined polymer masking layers for the deposition of titanium dioxide,”    Proceedings of SPIE-The International Society for Optical Engineering,  5753(Pt. 1, Advances in Resist Technology and Processing XXII), pp. 476-486, (2005).
  21. Hoskins, Trevor; Roman, Paul J.; Ludovice, Peter J.; Henderson, Clifford L..   “Equilibrium water uptake and diffusion behavior in model polynorbornene photoresist polymers,”    Proceedings of SPIE-The International Society for Optical Engineering,  5753(Pt. 2, Advances in Resist Technology and Processing XXII), pp. 851-861, (2005).
  22. Romeo, Michael; Finger, Isaac; Jeyakumar, Augustin; Wang, Guoan; Papapolymerou, John; Henderson, Clifford L..   “Photodefinable metal oxide dielectrics II: Direct fabrication of patterned high-k dielectrics for low cost RF capacitive MEMS switches,”    Materials Research Society Symposium Proceedings,  833(Materials, Integration and Packaging Issues for High-Frequency Devices II), pp. 217-222, (2005).
  23. Comeau, Benita M.; Umar, Yusif; Gonsalves, Kenneth E.; Henderson, Clifford L..   “New materials and methods for hierarchically structured tissue scaffolds,”    Materials Research Society Symposium Proceedings,  845(Nanoscale Materials Science in Biology and Medicine), pp. 105-110, (2005).
  24. Thomas, Mikkel A.; Lillie, Jeffrey; Kim, Dae-Ik; Ralph, Stephen; Jokerst, Nan Marie; Brooke, Martin; Dennis, Karla; Comeau, Benita; Henderson, Clifford L..   “An interferometric sensor for integration with Si CMOS signal processing circuitry: "Sensor on a Chip".,”   Trends in Optics and Photonics,  96/A(Conference on Lasers and Electro-Optics, 2004), pp. CTuG6/1-CTuG6/2, (2004).
  25. Tang, Yanyan; Henderson, Clifford L.; Muzzy, John; Rosen, David W.  “Stereolithography cure process modeling using acrylate resin,”   Solid Freeform Fabrication Symposium Proceedings, pp. 612-623, (2004).
  26. Berger, Cody M.; Henderson, Clifford L..  “Chemically amplified photoresist characterization using interdigitated electrodes: an improved method for determining the Dill C parameter,”  Proceedings of SPIE-The International Society for Optical Engineering,  5376(Pt. 2, Advances in Resist Technology and Processing XXI),  pp. 995-1006, (2004).
  27. White, Celesta E.; Henderson, Clifford L..  “Photosensitive co-polycarbonates for use as sacrificial materials in the fabrication of microfluidic and microelectromechanical devices,”  Proceedings of SPIE-The International Society for Optical Engineering,  5376(Pt. 2, Advances in Resist Technology and Processing XXI),  pp. 850-860, (2004).
  28. Hoskins, Trevor; Berger, Cody M.; Ludovice, Peter J.; Henderson, Clifford L.; Seger, Larry D.; Chang, Chun; Rhodes, Larry F.  “Effect of photoacid generator additives on the dissolution behavior of bis-trifluoromethyl carbinol substituted polynorbornene,”  Proceedings of SPIE-The International Society for Optical Engineering,  5376(Pt. 2, Advances in Resist Technology and Processing XXI),  pp. 1053-1063, (2004).
  29. Singh, Lovejeet; Ludovice, Peter J.; Henderson, Clifford L..  “Effect of film thickness on the dissolution rate behavior of photoresist polymer thin films,”  Proceedings of SPIE-The International Society for Optical Engineering,  5376(Pt. 2, Advances in Resist Technology and Processing XXI),  pp. 1007-1016, (2004).
  30. White, Celesta E.; Anderson, Travis; Henderson, Clifford L.; Rowland, Harry D.; King, William P.  “Microsystems manufacturing via embossing of photodefinable thermally sacrificial materials,”  Proceedings of SPIE-The International Society for Optical Engineering,  5374(Pt. 1, Emerging Lithographic Technologies VIII),  pp. 361-370, (2004).
  31. Jeyakumar, Augustin; Henderson, Clifford L..  “Enhancing the electron beam sensitivity of hydrogen silsesquioxane (HSQ),”  Proceedings of SPIE-The International Society for Optical Engineering,  5376(Pt. 1, Advances in Resist Technology and Processing XXI),  pp. 490-501, (2004).
  32. Singh, Lovejeet; Ludovice, Peter J.; Henderson, Clifford L..  “Effect of nanoscale confinement on the diffusion behavior of photoresist polymer thin films,”  Proceedings of SPIE-The International Society for Optical Engineering,  5376(Pt. 1, Advances in Resist Technology and Processing XXI),  pp. 369-378, (2004).
  33. Henderson, Clifford L.; Singh, Lovejeet; Ludovice, Peter J.  “The effect of thin film confinement on the physiochemical properties of polymer ultra-thin films: diffusion behavior,”  Polymeric Materials Science and Engineering,  90, pp. 350-351, (2004).
  34. Henderson, Clifford L.; Singh, Lovejeet; Ludovice, Peter J.  “Diffusion behavior of polymer ultrathin films: Implications for future photoresist materials,”  Abstracts of Papers, 227th ACS National Meeting, Anaheim, CA, United States, March 28-April 1, 2004, PMSE-214, (2004).
  35. Tang, Y.; Henderson, C.L.; Muzzy, J.; Rosen, D.W.  “Stereolithography Cure Modeling and Simulation,” Proceedings of VR@P 2003-International Conference on Advanced Research in Virtual and Rapid Prototyping, (accepted).
  36. Berger, C.; Henderson, C.L.  “Measurement of photoacid generation kinetics in photoresist thin films via capacitance techniques,”  Proceedings of SPIE-The International Society for Optical Engineering,  5039(Pt. 2, Advances in Resist Technology and Processing XX),  pp. 322-333, (2003).
  37. Ali, M.A.; Gonsalves, K.E.; Agrawal, A.; Jeyakumar, A.; Henderson, C.L.  “Nanocomposite resist for low voltage electron beam lithography (LVEBL),”  Proceedings of SPIE-The International Society for Optical Engineering,  5039(Pt. 2, Advances in Resist Technology and Processing XX),  pp. 442-452, (2003).
  38. Jeyakumar, A.; Henderson, C.L.  “Hybrid bilayer imaging approach using single component metal-organic precursors for high resolution electron beam lithography,”  Proceedings of SPIE-The International Society for Optical Engineering,  5039(Pt. 2, Advances in Resist Technology and Processing XX),  pp. 502-512, (2003).
  39. Hoskins, T.; Chung, W.J.; Ludovice, P.J.; Henderson, C.L.; Seger, L.D.; Rhodes, L.F.; Shick, R.A.  “Dissolution behavior of bis-trifluoromethyl carbinol substituted polynorbornenes,”  Proceedings of SPIE-The International Society for Optical Engineering,  5039(Pt. 2, Advances in Resist Technology and Processing XX),  pp. 600-611, (2003).
  40. Berger, C.M.; Henderson, C.L.  “Equilibrium sorption and rate of diffusion of water into photoresist thin films,”  Proceedings of SPIE-The International Society for Optical Engineering,  5039(Pt. 2, Advances in Resist Technology and Processing XX),  pp. 984-995, (2003).
  41. Singh, L.; Ludovice, P.J.; Henderson, C.L.  “Influence of film thickness, molecular weight, and substrate on the physical properties of photoresist polymer thin films,”  Proceedings of SPIE-The International Society for Optical Engineering,  5039(Pt. 2, Advances in Resist Technology and Processing XX),  pp. 1008-1018, (2003).
  42. Agrawal, A.; Henderson, C.L.  “Investigation of surface inhibition and its effect on the lithographic performance of polysulfone-novolac electron beam resists,”  Proceedings of SPIE-The International Society for Optical Engineering,  5039(Pt. 2, Advances in Resist Technology and Processing XX),  pp. 1019-1030, (2003).
  43. Jeyakumar, A.; Henderson, C.L.  “A comparative study between organic and inorganic resists in electron beam lithography using monte carlo simulations,”  Proceedings of SPIE-The International Society for Optical Engineering,  5039(Pt. 2, Advances in Resist Technology and Processing XX),  pp. 1192-1203, (2003).
  44. Chen, X.; Ruhe, J.; Tolbert, L.M.; Hess, D.W.; Henderson, C.L.  “Highly aromatic polymer brushes: Toward molecular masks,”  Polymer Preprints (American Chemical Society, Division of Polymer Chemistry),  44(1),  454, (2003).
  45. Agrawal, A.; Henderson, C.L.  “Polysulfone-novolac resist for electron beam lithography: part I. fundamental studies of resist properties,”  Proceedings of SPIE-The International Society for Optical Engineering,  4690(Pt. 2, Advances in Resist Technology and Processing XIX),  pp. 1138-1149, (2002). 
  46. Jeyakumar, A.; Barstow, S.J.; Henderson, C.L.  “Novel bilayer resist approach using radiation sensitive organometalics precursors,”  Proceedings of SPIE-The International Society for Optical Engineering,  4690(Pt. 2, Advances in Resist Technology and Processing XIX),  pp. 1034-1042, (2002).
  47. McCoy, K.; Gumieny, C.; Hess, D.W.; Tolbert, L.M.; Henderson, C.L.  “Novel surface imaging method using surface monolayer initiated polymerization,”  Proceedings of SPIE-The International Society for Optical Engineering,  4690(Pt. 2, Advances in Resist Technology and Processing XIX),  pp. 1025-1033, (2002).
  48. Agrawal, A.; Henderson, C.L.  “Polysulfone-novolac resist for electron-beam lithography: II. effects of resist formulation and processing,”  Proceedings of SPIE-The International Society for Optical Engineering,  4690(Pt. 1, Advances in Resist Technology and Processing XIX),  pp. 453-464 (2002).
  49. White, C.E.; Henderson, C.L.  “Synthesis and characterization of photodefinable polycarbonates for use as sacrificial materials in the fabrication of microfluidic devices,”  Proceedings of SPIE-The International Society for Optical Engineering,  4690(Pt. 1, Advances in Resist Technology and Processing XIX),  pp. 242-253, (2002).
  50. Barstow, S.J.; Jeyakumar, A.; Henderson, C.L.  “Direct photopatterning of metal oxide materials using photosensitive organometallic precursor films,”  Proceedings of SPIE-The International Society for Optical Engineering,  4688(Pt. 1, Emerging Lithographic Technologies VI),  pp. 421-430, (2002).   
  51. Bhusari, D.; Reed, H.; Wedlake, M.; Allen, S.A.; Henderson, C.L.; Kohl, P.A. “Fabrication of Air-Channel Structures for Microfluidic Applications,” Proceedings of. NSF DMII Conference 2001, (2001).
  52. McCoy, K.M.; Hess, D.W.; Tolbert, L.M.; Henderson, C.L. “Top Surface Imaging via Surface Initiated Polymerization,” Proceedings of SRC TECHCON 2000, (2000).
  53. Rathsack, B..M.; Tabery, C.E.; Scheer, S.A.; Pochkowski, M.; Philbin, C.; Kalk, F.; Henderson, C.L.; Buck, P.D.; Willson, C.G. “Optical Lithography Simulation and Photoresist Optimization for Photomask Fabrication,” Proceedings of SPIE-The International Society for Optical Engineering,  3678(Advances in Resist Technology and Processing XVI), pp. 1215-26, (1999).
  54. Dammel, R.R.; Sagan, J.P.; Kokinda, E.; Eilbeck, N.; Mack, C.A.; Arthur, G.G.; Henderson, C.L.; Scheer, S.A.; Rathsack, B.M.; Willson, C.G. “Improved Simulation of Photoresists Using New Development Models,” Proceedings of SPIE-The International Society for Optical Engineering,  3333(Advances in Resist Technology and Processing XV), pp. 401-416, (1998).
  55. Synowicki, R.A.; Hilfiker, J.N.; Dammel, R.R.; Henderson, C.L. “Refractive Index Measurements of Photoresist and Antireflective Coatings with Variable Angle Spectroscopic Ellipsometry,” Proceedings of SPIE-The International Society for Optical Engineering, 3332(Metrology, Inspection, and Process Control for Microlithography XII), pp. 384-390, (1998).
  56. Erdmann, A.; Henderson, C. L.; Willson, C. G.; Dammel, R. R. “Some Aspects of Thick Film Resist Performance and Modeling,” Proceedings of SPIE-The International Society for Optical Engineering,  3333(Advances in Resist Technology and Processing XV), pp. 1201-1211, (1998).
  57. McAdams, C. L.; Flanagin, L. W.; Henderson, C. L.; Pawloski, A. R.; Tsiartas, P.; Willson, C. G. “Dissolution of Phenolic Polymers in Aqueous Base: Influence of Polymer Structure,” Proceedings of SPIE-The International Society for Optical Engineering,  3333(Advances in Resist Technology and Processing XV), pp. 1171-1179, (1998).
  58. Postnikov, S. V.; Somervell, M. H.; Henderson, C. L.; Katz, S.; Willson, C. G. “Top Surface Imaging through Silylation,” Proceedings of SPIE-The International Society for Optical Engineering,  3333(Advances in Resist Technology and Processing XV), pp. 997-1008, (1998).
  59. Flanagin, L. W.; McAdams, C. L.; Tsiartas, P. C.; Henderson, C. L.; Hinsberg, W. D.; Willson, C. G. “Probabilistic Model for the Mechanism of Phenolic Polymer Dissolution,” Proceedings of SPIE-The International Society for Optical Engineering,  3333(Advances in Resist Technology and Processing XV), pp. 268-277, (1998).
  60. Henderson, C. L., Scheer, S. A., Tsiartas, P. C., Rathsack, B. M., Sagan, J. P., Dammel, R. R., Erdmann, A., Willson, C. G. “Modeling Parameter Extraction for DNQ-Novolac Thick Film Resists,” Proceedings of SPIE-The International Society for Optical Engineering,  3333(Advances in Resist Technology and Processing XV), pp. 256-267, (1998).
  61. Erdmann, A.; Henderson, C.L.; Willson, C.G.; Dammel, R.R. “The Influence of Resist Refractive Index Changes on Thick Film Resist Performance and Modeling,” Proceedings of SPIE-The International Society for Optical Engineering,  3333(Advances in Resist Technology and Processing XV), pp. 710-722, (1998).
  62. Henderson, C.L.; Tsiartas, P.C.; Flanagin, L.W.; Pancholi, S.N.; Chowdhury, S.A.; Dombrowski, K.D.; Chinwalla, A.N.; Willson, C.G. "Photoresist Characterization for Lithography Simulation Part 4: Processing Effects on Resist Parameters," Proceedings of SPIE-The International Society for Optical Engineering,  3049(Advances in Resist Technology and Processing XIV), pp. 212-223, (1997).
  63. Henderson, C.L.; Tsiartas, P.C.; Pancholi, S.N.; Chowdhury, S.A.; Dombrowski, K.D.; Willson, C.G.; Dammel, R.R. "Photoresist Characterization for Lithography Simulation Part 3: Development Parameter Measurements," Proceedings of SPIE-The International Society for Optical Engineering,  3049(Advances in Resist Technology and Processing XIV), pp. 805-815, (1997).
  64. Henderson, C.L.; Pancholi, S.N.; Chowdhury, S.A.; Willson, C.G.; Dammel, R.R. "Photoresist Characterization for Lithography Simulation Part 2: Exposure Parameter Measurements," Proceedings of SPIE-The International Society for Optical Engineering,  3049(Advances in Resist Technology and Processing XIV), pp. 816-828, (1997).
  65. Henderson, C.L.; Willson, C.G.; Dammel, R.R.; Synowicki, R.A. "Bleaching Induced Changes in the Dispersion Curves of DNQ Resists," Proceedings of SPIE-The International Society for Optical Engineering,  3049(Advances in Resist Technology and Processing XIV), pp. 585-595, (1997).
  66. Erdmann, A., Henderson, C.L., Willson, C.G., Henke, W. "Influence of Optical Nonlinearities of  the Photoresist on the Photolithographic Process:  Applications," Proceedings of SPIE-The International Society for Optical Engineering,  3048(Emerging Lithographic Technologies), pp. 114-124, (1997).
  67. Erdmann, A.;  Henderson, C.L.; Willson, C.G.; Henke, W. “Influence of Optical Nonlinearities of Photoresists on the Photolithographic Process: Basics,” Proceedings of SPIE-The International Society for Optical Engineering,  3051(Optical Microlithography X), pp. 529-40, (1997).
  68. Gardiner, A.B.; Qin, A.; Henderson, C.L.; Pancholi, S.; Koros, W.J.; Willson, C.G. “Diffusivity Measurements in Polymers II: Residual Casting Solvent Measurement by Liquid Scintillation Counting,” Proceedings of SPIE-The International Society for Optical Engineering,  3049(Advances in Resist Technology and Processing XIV), pp. 850-860, (1997).
  69. Henderson, C.L.; Tsiartas, P.C.; Simpson, L.L.; Clayton, K.D.; Pawloski, A.R.; Pancholi, S.N.; Willson, C.G. "Factors Affecting the Dissolution Rate of Novolac Resins II: Developer Composition Effects," Proceedings of SPIE-The International Society for Optical Engineering,  2724(Advances in Resist Technology and Processing XIII), pp. 481-90, (1996).
  70. Henderson, C.L.; Clayton, K.D.; Willson, C.G. "Modeling the Lithographic Process I: Equipment Design and Modeling Analysis for a Series of Commercial I-Line Resists," Proc. SRC TECHCON 1996, (1996).

 

D.  Presentations

  1. Invited: “Molecular Resists for EUV Lithography,” 2008 SEMATECH Litho Forum, Lake George, NY, May 2008.
  2. “Single Component Molecular Resists for EUVL Lithography,” Presenter: Wang Yueh, 2007 EUVL International Symposium, Sapporo, Japan, October 2007.
  3. Invited: “Recent Developments in Resist Materials for Sub-50nm Lithography,” IISB Litho Workshop, Hersbuck, Germany, September 2007.
  4. “The Effect of Direct PAG Incorporation into the Polymer Main Chain on Reactive Ion Etch Resistance of 193 nm and EUV Chemically Amplified Resists,” Micro and Nano Engineering 2008, Copenhagen, Denmark, September 2007.
  5. Invited: “Epoxide functionalized molecular resists for high resolution electron beam lithography,” Micro and Nano Engineering 2008, Copenhagen, Denmark, September 2007.
  6. “Nanopatterning Materials Using Area Selective Atomic Layer Deposition in Conjunction with Thermochemical Surface Modification via Heated AFM Cantilever Probe Lithography,” Micro and Nano Engineering 2008, Copenhagen, Denmark, September 2007.
  7. “Influence of solubility switching mechanism on resist performance in molecular glass resists,” Presenter: Richard Lawson, EIPBN 2008, Denver, CO, May 2007.
  8. “Effects of photoacid generator incorporation into the polymer main chain on 193 nm chemically amplified resist behavior and lithographic performance,” Presenter: Cheng-Tsung Lee, EIPBN 2008, Denver, CO, May 2007.
  9. “Effect of Cross-linking on Polymer Patterning Using Heated AFM Probes”, EIPBN 2008, Denver, CO, May 2007.
  10. Invited: “Patterning & Fabrication Techniques for Micro- & Nanostructured Materials: Enabling advancement in electronics, energy, biology, and beyond,” 4/3/2007, University of Maryland-Department of Chemical Engineering, April 2007.
  11. “Molecular glass photoresists containing photoacid generator functionality: A route to a single-molecule photoresist,” Presenter: Richard Lawson, SPIE Advanced Lithography Symposium, San Jose, CA, February 2007.
  12. “Novel photodefinable low-k dielectric polymers based on polybenzoxazines,” SPIE Advanced Lithography Symposium, San Jose, CA, February 2007.
  13. “A novel top surface imaging approach utilizing direct-area selective atomic layer deposition of hardmasks,”     SPIE Advanced Lithography Symposium, San Jose, CA, February 2007.
  14. “Novel anionic photoacid generator (PAGs) and photoresist for sub-50-nm patterning by EUVL and EBL,” SPIE Advanced Lithography Symposium, San Jose, CA, February 2007.
  15. “Photosensitivity and line-edge roughness of novel polymer-bound PAG photoresists,” SPIE Advanced Lithography Symposium, San Jose, CA, February 2007.
  16. “Direct three-dimensional nanoscale thermal lithography at high speeds using heated atomic-force microscope cantilevers,”  SPIE Advanced Lithography Symposium, San Jose, CA, February 2007.
  17. Invited: “Micro- and Nanopatterning of Materials: An Enabling Technology for Applications Ranging from Semiconductors toTissue Engineering,” Department of Chemical Engineering, University of South Carolina , May 2006.
  18. Invited: “New Methods and Materials for MEMS and Microfluidic Device Fabrication and Packaging Based on the Use of Thermally Sacrificial Polymers,” GE Global Research, October 2006.
  19. Invited: “Micro- and Nanostructuring of Materials: Applications in Energy and the Environment” National Science Foundation-US China International Workshop on Chemical Engineering, August 2006.
  20. Invited: “Recent Progress on Modeling and Characterization of Photoresist Material Behavior in High Resolution Lithography Processes,”  Sigma-C, July 2006.
  21. Invited: “Single Component Molecular Glass Resists for EUVL,” SEMATECH, September 2006.
  22. Invited: “Physiochemical Property Changes in Resist Materials When Confined to Small Geometries,” SEMATECH, November 2006.
  23. Invited: “Recent Advances in Materials and Methods for Nanopatterning Using Probe Tips,” DARPA, December 2006.
  24. “Area Selective Atomic Layer Deposition of Titania,” with Ashwini Sinha, Dennis Hess (speaker), ECS Fall National Meeting, Cancun, MX, October 2006.
  25. “Novel Microfabrication Methods and Materials for Hierarchically Structured Tissue Engineering Scaffolds,” with Benita M. Comeau, ECS Fall National Meeting, Cancun, MX, October 2006.
  26. “Novel Low-Dielectric Constant Photodefinable Polyimides for Low-Temperature Polymer Processing,” with Kazuhiro Yamanaka, Michael Romeo, and Kazuhiko Maeda, ECS Fall National Meeting, Cancun, MX, October 2006.
  27. “Photodefinable Sacrificial Polycarbonate Materials & Methods for MEMS & Microfluidic Device Fabrication,” with Yueming Hua, ECS Fall National Meeting, Cancun, MX, October 2006.
  28. “Photodefinable Sacrificial Polycarbonate Materials & Methods for MEMS & Microfluidic Device Fabrication,” with Yueming Hua, ECS Fall National Meeting, Cancun, MX, October 2006.
  29. “Novel Microfabrication Methods and Materials for Hierarchically Structured Tissue Engineering Scaffolds,” with Benita M. Comeau (speaker), BMES National Meeting, Chicago, IL, October 2006.
  30. “New Photodefinable Dielectric Polymer Thin Film Materials for Microelectronics and Optoelectronics Based on Novel Hexafluoralcohol Substituted Monomers,” with Kazuhiro Yamanaka, Kazuhiko Maeda, and Michael Romeo, AICHE Fall National Meeting, San Francisco, CA, November 2006.
  31. “Lithography Via Top Surface Imaging Using Area Selective Atomic Layer Deposition,” with Ashwini Sinha and Dennis Hess, AICHE Fall National Meeting, San Francisco, CA, November 2006.
  32. “Recent Progress on Developing Advanced Methods and Materials for Fabricating Hierarchically Structured Tissue Engineering Scaffolds Using Stereolithography,”  with Benita Comeau, AICHE Fall National Meeting, San Francisco, CA, November 2006.
  33. “Recent Advances in Nanoscale Thermal Lithography Using Heated Atomic Force Microscope Cantilevers and Cantilever Arrays,” with Yueming Hua and William King, AICHE Fall National Meeting, San Francisco, CA, November 2006.
  34. “Fundamental Diffusion Behavior of Polymer Ultrathin Films: Effect of Film Thickness, Molecular Weight, and Aging,” with Ivan Ordaz and Richard Lawson, AICHE Fall National Meeting, San Francisco, CA, November 2006.
  35. “Novel low-dielectric constant photodefinable polyimides for low-temperature polymer processing,” with Michael Romeo, Kazuhiro Yamanaka, and Kazuhiko Maeda, 2006 SPIE Microlithography Symposium, San Jose, CA, February 2006.
  36. “Nanolithography in thermally sacrificial polymers using nanoscale thermal probes,” with Yueming Hua (speaker), Shubham Saxena, and William P. King, 2006 SPIE Microlithography Symposium, San Jose, CA, February 2006.
  37. “Fundamental studies of the properties of photoresists based on resins containing polymer-bound photoacid generators,” Cheng-Tsung Lee, Nathan D. Jarnagin, Mingxing Wang, Kenneth Gonsalves, Jeanette Roberts, and Wang Yueh, 2006 SPIE Microlithography Symposium, San Jose, CA, February 2006.
  38. “Nanoelectronics writing using heated probe tips,” with William King, Brent A. Nelson, Shubham Saxena, Yueming Hua (speaker), 2006 SPIE Microlithography Symposium, San Jose, CA, February 2006.
  39. “Elucidation of structure-property relationships in polymers for microelectronics using computer simulation,” with Trevor Hoskins, Derrick Callander, Lovejeet Singh and Peter Ludovice (speaker), American Chemical Society National Meeting, Atlanta, GA, April 2006.
  40. “Photodefinable thermally sacrificial polymers and processes for microelectronics and MEMS fabrication,” with Yueming Hua (speaker), American Chemical Society National Meeting, Atlanta, GA, April 2006.
  41. “A novel nanopatterning method using heated AFM probe tips,” with Yueming Hua (speaker) and William P. King, MRS Fall National Meeting, Boston, MA, December 2006.
  42. “Novel Polymeric Anionic Photoacid Generators (PAGs) and Photoresists for sub 100 nm Patterning by 193 nm Lithography,”  with Mingxing Wang(speaker), Cheng-Tsung Lee, Nathan D. Jarnagin, Wang Yueh, Jeanette M. Roberts, and Kenneth E. Gonsalves, MRS Fall National Meeting, Boston, MA, December 2006.
  43. “Novel Anionic Photoacid Generators (PAGs) and Photoresists for sub 50 nm Patterning by EUVL and EBL,” with Mingxing Wang(speaker), Nathan D. Jarnagin, Wang Yueh, Jeanette M. Roberts, and Kenneth E. Gonsalves, MRS Fall National Meeting, Boston, MA, December 2006.
  44. “Single Component Molecular Glass Resists for Nanofabrication: Compounds Incorporating Acid Generator, Etch Resistant, and Protecting Groups into a Single Molecule,” with Richard Lawson (speaker), MRS Fall National Meeting, Boston, MA, December 2006.
  45. “Novel Microfabrication Methods and Materials for Producing 3D Physically and Chemically Structured Polymeric Tissue Engineering Scaffolds,” with Benita M. Comeau (speaker), MRS Fall National Meeting, Boston, MA, December 2006.
  46. “Elucidation of structure-property relationships in polymers for microelectronics using computer simulation,” with Trevor Hoskins, Derrick Callander, Lovejeet Singh and Peter Ludovice (speaker), American Chemical Society National Meeting, Atlanta, GA, April 2006.
  47. “New fabrication methods for forming patterned metal oxide micro- and nanostructures”, with Jeyamkumar, A.; Roman, P.J.; Romeo, M.; Henderson, C.L. (speaker), 7th World Congress of Chemical Engineering, Glasgow, UK, July 2005.
  48. “Engineering new materials and methods for hierarchically structured tissue scaffolds,” with Comeau, B.; Umar, Y.; Gonsalves, K.E.; Katz, B.; Henderson, C.L. (speaker), 7th World Congress of Chemical Engineering, Glasgow, UK, July 2005.
  49. “Effect of film composition on the performance of interdigitated electrode methods used for chemically amplified photoresist characterization: methods for analyzing photoresist materials containing base quencher,” with Berger, C.; Henderson, C.L. (speaker),  SPIE Microlithography Conference, Santa Clara, CA, February 2005.
  50. “Characterization of property variation in ultra-thin polymer films from molecular simulation,” with Singh, Lovejeet; Henderson, Clifford L.; Ludovice, Peter J. (speaker),  SPIE Microlithography Conference, Santa Clara, CA, February 2005.
  51. “The effect of film thickness on the dissolution rate and hydrogen bonding behavior of photoresist polymer thin films,” with Singh, Lovejeet; Ludovice, Peter J.; Henderson, Clifford L. (speaker),  SPIE Microlithography Conference, Santa Clara, CA, February 2005.
  52. “Material design and evaluation of nanocomposite resist for next generation lithography,” with Gonsalves, Kenneth E.; Thiyagarajan, Muthiah; Dean, Kim; Santiago, Patricia; Rendon, L.; Jeyakumar, Augustin; Henderson, Clifford L. (speaker),  SPIE Microlithography Conference, Santa Clara, CA, February 2005.
  53. “Area selective atomic layer deposition: use of lithographically defined polymer masking layers for the deposition of titanium dioxide,”  with Sinha, A. (speaker); Hess, D.W.; Henderson, C.L.; SPIE Microlithography Conference, Santa Clara, CA, February 2005.
  54. “Equilibrium water uptake and diffusion behavior in model polynorbornene photoresist polymers,” with Hoskins, Trevor (speaker); Roman, Paul J.; Ludovice, Peter J.; Henderson, Clifford L.,  SPIE Microlithography Conference, Santa Clara, CA, February 2005.  
  55. “Small Molecule Diffusion in Polymer Ultra-Thin Films,” with Ordaz, Ivan; Singh, Lovejeet; Ludovice, Peter J. Ludovice; Henderson, Clifford L. (speaker),  MRS Fall National Meeting, Boston, MA, December 2005.
  56. “Materials and Processes for High Resolution Nanostructure Fabrication using Thermal Cantilever Lithography,” with Hua, Yueming Hua; Saxena, Shubham; King, William P.; Henderson, Clifford L. (speaker), MRS Fall National Meeting, Boston, MA, December 2005.
  57. “New Materials and Methods for Patterned Cell Growth on Polymer Scaffolds,” with Katz, Benjamin (speaker); Comeau, Benita; Henderson, Clifford L., MRS Fall National Meeting, Boston, MA, December 2005.
  58. “Photoacid Diffusion in Photoresist Polymer Thin Films: Approaches for Measurement and Control of Thin Film Acid Diffusion,” with Lee, Cheng-Tsung; Henderson, Clifford L. (speaker), AICHE Fall National Meeting, Cincinnati, OH, November 2005.
  59. “Materials and Processes for High Resolution Patterning using Thermal Cantilever Array Lithography,” with Hua, Yueming; Saxena, Shubham; King, William P.; Henderson, Clifford L. (speaker), AICHE Fall National Meeting, Cincinnati, OH, November 2005.
  60. “Area Selective Atomic Layer Deposition Using Photodefinable Polymer Masks,” with Sinha, Ashwini (speaker); Hess, Dennis W.; Henderson, Clifford L., AICHE Fall National Meeting, Cincinnati, OH, November 2005.
  61. “The Diffusion Behavior of Polymer Ultra-thin Films: Fundamental Insights and Molecular Weight Effects,” with Ordaz, Ivan; Singh, Lovejeet; Ludovice, Peter J (speaker).; Henderson, Clifford L., AICHE Fall National Meeting, Cincinnati, OH, November 2005.
  62. “Material and Process Approaches to the Fabrication of Hierarchically Structured Tissue Engineering Scaffolds,” with Comeau, Benita (speaker); Katz, Benjamin; Henderson, Clifford L., AICHE Fall National Meeting, Cincinnati, OH, November 2005.
  63. Invited: “Diffusion Behavior in Polymer Ultrathin Films”, IBM Almaden Research Center, February 2005.
  64. Invited:  “Diffusion behavior of polymer ultrathin films: Implications for future photoresist materials,”  227th ACS National Meeting, Anaheim, CA, (2004).
  65. Invited: “Designing Materials & Processes for Nanofabrication,” Univeristy of California-Santa Barbara, Department of Chemical Engineering Seminar, Santa Barbara, CA, (May 2004).
  66. Invited: “Future Challenges and Opportunities in Semiconductor Manufacturing,” University College London, Department of Chemical Engineering Seminar, London, England, (July 2004).
  67. Invited: “Opportunities and Challenges for Process Control and Sensor Technology in Semiconductor Manufacturing,”  Georgia Tech CPSE Annual Meeting, Atlanta, GA, (May 2004).
  68. “Formation of Patterned Crystalline Oxide Structures using Photosensitive Metal-Organics and Hydrothermal Processing,”  Materials Research Society Fall National Meeting (2004 Functional and Multifunctional Oxides), (2004).
  69. “Fundamental Studies of the Dissolution Behavior of Model Photoresist Resins Based on Substituted Polynorbornenes,”  Materials Research Society Fall National Meeting (2004 Photoresist Development and Fundamentals), (2004). Presented by Trevor Hoskins.
  70. “Photoresist Polymers with Polymer Bound Photoacid Generators: Fundamental Characterization of Photochemical, Diffusion, and Resolution Behavior,” Materials Research Society Fall National Meeting (2004 Photoresist Development and Fundamentals), (2004).
  71. “Fundamental Studies of the Thickness Dependent Behavior of Photoresist Ultrathin Films: An Overview and Update,” Materials Research Society Fall National Meeting (2004 Photoresist Development and Fundamentals), (2004).
  72. “Methods for Enhancing the Sensitivity of Hydrogen Silsesquioxane for sub-100 nm Electron Beam Lithography,” Materials Research Society Fall National Meeting (2004 Photoresist Development and Fundamentals), (2004).
  73. Invited: “New Materials and Methods for Hierarchically Structured Tissue Scaffolds,” Materials Research Society Fall National Meeting (2004 Three Dimensional Scaffolds and BioMEMS), (2004).
  74. “Photodefinable Mixed Oxide Dielectrics II: Direct Fabrication of Patterned High-k Dielectrics for Low Cost RF Capacitive MEMS Switches,”  Materials Research Society Fall National Meeting (2004 MEMS & Integration), (2004).
  75. “Influence of Thin Film Confinement on the Physical Properties of Polymer Ultra-Thin Films,” AICHE Fall National Meeting, Austin, TX, (2004).
  76. “The Effects of Chemically Amplified Photoresist Composition upon Capacitance Based Acid Generation Measurement in Polymer Thin Films Using Interdigitated Electrodes,” AICHE Fall National Meeting, Austin, TX, (2004).
  77. “Area Selective Atomic Layer Deposition of TiO2 Films,” AICHE Fall National Meeting, Austin, TX, (2004).
  78. “Nanolithography and Direct Fabrication of Oxide Nanostructures using Radiation Sensitive Metal-Organic Precursors,” AICHE Fall National Meeting, Austin, TX, (2004).
  79. “Computational and Experimental Study of the Coefficient of Thermal Expansion of Polynorbornenes for Microelectronics Applications,” AICHE Fall National Meeting, Austin, TX, (2004). Presented by Professor Peter Ludovice.
  80. Invited: “Characterization of Property Variation in Ultra-Thin Polymer Films from Molecular Simulation,” IEEE Polytronics Meeting, Portland, OR, Sept. 2004. Presented by Professor Peter Ludovice.
  81. “Patterning via surface monolayer initiated polymerization: A study of surface initiator photoreaction kinetics,”  EIPBN 2004, (2004).  Presented by Dr. Kendra McCoy.
  82. “Stereolithography cure process modeling using acrylate resin,”   Solid Freeform Fabrication Symposium, Austin, TX, (2004).  Presented by Yanyan Tang
  83. “Chemically amplified photoresist characterization using interdigitated electrodes: an improved method for determining the Dill C parameter,” SPIE Microlithography Conference, Santa Clara, CA, (2004).  Presented by Cody Berger.
  84. “Photosensitive co-polycarbonates for use as sacrificial materials in the fabrication of microfluidic and microelectromechanical devices,”  SPIE Microlithography Conference, Santa Clara, CA, (2004).
  85. “Effect of photoacid generator additives on the dissolution behavior of bis-trifluoromethyl carbinol substituted polynorbornene,”  SPIE Microlithography Conference, Santa Clara, CA, (2004).  Presented by Trevor Hoskins.
  86. “Effect of film thickness on the dissolution rate behavior of photoresist polymer thin films,”  SPIE Microlithography Conference, Santa Clara, CA, (2004).  Presented by Lovejeet Singh.
  87. “Microsystems manufacturing via embossing of photodefinable thermally sacrificial materials,”  SPIE Microlithography Conference, Santa Clara, CA, (2004).
  88. “Enhancing the electron beam sensitivity of hydrogen silsesquioxane (HSQ),”  SPIE Microlithography Conference, Santa Clara, CA, (2004).  Presented by Augustin Jeyakumar.
  89. “Effect of nanoscale confinement on the diffusion behavior of photoresist polymer thin films,”  SPIE Microlithography Conference, Santa Clara, CA, (2004).  Presented by Lovejeet Singh. 
  90. “The effect of thin film confinement on the physiochemical properties of polymer ultra-thin films: diffusion behavior,”  227th ACS National Meeting-PMSE Division, Anaheim, CA, (2004).
  91. Invited: “Patterning at the Nanoscale: Understanding Photoresist Materials and Beating the Limits in Lithography,” Department of Chemical Engineering, The University of Florida, Gainesville, FL, (2003).
  92. Invited: “Advanced Design and Characterization of Photoresist Materials for Nanolithography,” Department of Chemistry, The University of North Carolina-Charlotte, Charlotte, NC, (2003).
  93. Invited: “Patterning at the Nanoscale: Designing Materials & Processes to Enable Nanolithography,” The University of Texas at Austin, Department of Chemical Engineering Seminar, Austin, TX, (2003).
  94. “Measurement of photoacid generation kinetics in photoresist thin films via capacitance techniques,”  SPIE Microlithography Conference, Santa Clara, CA, (2003). 
  95. “Nanocomposite resist for low voltage electron beam lithography (LVEBL),”  SPIE Microlithography Conference, Santa Clara, CA, (2003).
  96. “Hybrid bilayer imaging approach using single component metal-organic precursors for high resolution electron beam lithography,”  SPIE Microlithography Conference, Santa Clara, CA, (2003). 
  97. “Dissolution behavior of bis-trifluoromethyl carbinol substituted polynorbornenes,”  SPIE Microlithography Conference, Santa Clara, CA, (2003).
  98. “Equilibrium sorption and rate of diffusion of water into photoresist thin films,”  SPIE Microlithography Conference, Santa Clara, CA, (2003).
  99. “Influence of film thickness, molecular weight, and substrate on the physical properties of photoresist polymer thin films,”  SPIE Microlithography Conference, Santa Clara, CA, (2003).
  100. “Investigation of surface inhibition and its effect on the lithographic performance of polysulfone-novolac electron beam resists,”  SPIE Microlithography Conference, Santa Clara, CA, (2003).
  101. “A comparative study between organic and inorganic resists in electron beam lithography using monte carlo simulations,” SPIE Microlithography Conference, Santa Clara, CA, (2003). 
  102. “Effect of Thin Film Confinement on the Transport Properties of Ultra-Thin Polymer Films,” Materials Research Society Fall National Meeting (2003 Dynamics in Small Confining Systems VII), (2003).
  103. “Photodefinable Metal Oxide Dielectrics: A Novel Method for Fabricating Low Cost RF Capacitive MEMS Switches,” Materials Research Society Fall National Meeting (2003 Dynamics in Small Confining Systems VII), (2003).
  104. “Microsystems Manufacturing via Embossing of Thermally Sacrificial Polymers,” Materials Research Society Fall National Meeting (2003 Dynamics in Small Confining Systems VII), (2003). 
  105. “Dissolution Rate Modifiers Based on Oligomeric Norbornene Derivatives for Use in Chemically Amplifiied Cyclic Olefin Photoresists,” 13th International Conference on Photopolymers (SPE RETEC 2003), (2003).
  106. “Advances in a Novel Technique for Measuring Photoacid Generator Kinetics,” 13th International Conference on Photopolymers (SPE RETEC 2003), (2003).
  107. “A novel electron beam lithography process using radiation sensitive carboxylate metal-organic precursors,”  EIPBN 2003, (2003).
  108. “Development of improved photosensitive polycarbonate systems for the fabrication of microfluidic devices,”  EIPBN 2003, (2003).
  109. “Dissolution Inhibition Effect of Photoacid Generators in Poly(norbornene) Photoresist Materials,” AICHE Fall National Meeting, (2003).
  110. “Stereolithography(SL) Process Modeling”, AICHE Fall National Meeting, (2003). Presented by Yanyan Tang.
  111. “Effect of Film Thickness on the Transport Properties in Ultrathin Polymer Films,” AICHE Fall National Meeting, (2003).
  112. “Interdigitated Electrodes as a Novel Instrument for Measuring Photoacid Generator Kinetics,” AICHE Fall National Meeting, (2003).
  113. “Use of Computer Modeling to Predict Novel Applications of High Performance Poly(norbornene),” AICHE Fall National Meeting, (2003).
  114. Invited: “Advanced Resist Materials for 193 nm and 157 nm – Unique Challenges and Opportunities for Polynorbornenes as a Resist Material Platform,”  Promerus Electronic Materials, Brecksville, OH, (2002).
  115. Invited: “Patterning at the Nanoscale: Fundamental Behavior and Properties of Materials Used in Nanolithography,”  Georgia Institute of Technology, Physics Colloquium Series Seminar, Atlanta, GA, (2002).
  116. “Effect of Nanoscale Confinement on the Physical Properties of Polymeric Materials and Structures,”  Georgia Tech Nanoscience and Nanotechnology Conference, Atlanta, GA, (2002).
  117. “Novel Approaches to Nanopatterning,”  Georgia Tech Nanoscience and Nanotechnology Conference, Atlanta, GA, (2002).
  118. “Understanding the Anomalous Behavior of Fluorinated Polymer Photoresist Resins,”  AIChE Fall National Meeting, Indianapolis, IN, (2002).
  119. “Molecular Weight Dependence of the Glass Transition Temperature in Poly(styrene) Ultrathin Films,”  AIChE Fall National Meeting, Indianapolis, IN, (2002).
  120. “Influence of Film Thickness and Molecular Weight on the Glass Transition Temperature in Ultrathin Polymer Films,”  2002 Semiconductor Research Corporation/DARPA Annual Review Meeting, Austin, TX, (2002).
  121. “Novel Surface Imaging Method via Surface Monolayer Initiated Polymerization,”  2002 Semiconductor Research Corporation/DARPA Annual Review Meeting, Austin, TX, (2002).
  122. "A novel bilayer lithography process using radiation senstivite metal-organic precursors,"  2002 Semiconductor Research Corporation/DARPA Annual Review Meeting, Austin, TX, (2002).
  123. ”Sacrificial Materials for the Fabrication of Microfluidic Devices: Synthesis and Characterization of Photodefinable Polycarbonates,” 2002 Southeast Regional Meeting of the American Chemical Society, Charleston, SC, (2002).
  124. “Modeling of Properties for Polymer Glasses containing Nanomorphology,”  AIChE Fall National Meeting, Indianapolis, IN, (2002).
  125. “Photosensitive Polycarbonates for the Fabrication of Air-channels for the Microelectromechanical Systems,”  AIChE Fall National Meeting, Indianapolis, IN, (2002).
  126. “Polysulfone-novolac resist for electron beam lithography: part I. fundamental studies of resist properties,”  SPIE Microlithography Conference, Santa Clara, CA, (2002).
  127. “Novel bilayer resist approach using radiation sensitive organometalics precursors,”  SPIE Microlithography Conference, Santa Clara, CA, (2002).
  128. “Novel surface imaging method using surface monolayer initiated polymerization,”  SPIE Microlithography Conference, Santa Clara, CA, (2002).
  129. “Polysulfone-novolac resist for electron-beam lithography: II. effects of resist formulation and processing,”  SPIE Microlithography Conference, Santa Clara, (2002).
  130. “Synthesis and characterization of photodefinable polycarbonates for use as sacrificial materials in the fabrication of microfluidic devices,”  SPIE Microlithography Conference, Santa Clara, (2002).
  131. “Direct photopatterning of metal oxide materials using photosensitive organometallic precursor films,”  SPIE Microlithography Conference, Santa Clara, CA, (2002).
  132. Invited: “Novel approaches to nanopatterning: From surface monolayer initiated polymerization to hybrid organometallic-organic bilayers,” Materials Research Socitey Fall National Meeting, Boston, MA, (2001).
  133. “Fabrication of Air Channel Structures for Microfluidic Applications,” NSF DMII Research Conference 2001, Tampa, FL, (2001).
  134. “A Study of the Dissolution Behavior of Phenolic Polymers Using Multiple Wavelength Ellipsometry,” AIChE Fall National Meeting, Dallas, TX, (1999).
  135. “Opportunities for Photosensitive Organometallic Materials in Microelectronics,” EKC Technology Inc., Hayward, CA, (1999).
  136. “Modeling Parameter Extraction for DNQ-Novolac Thick Film Resists,” SPIE Microlithography Conference, Santa Clara, CA, (1998).
  137. “Introduction to Resist Modeling”, Motorola Advanced Lithography Symposium, Austin, TX,  (1997).
  138. "Photoresist Characterization for Lithography Simulation Part 4: Processing Effects on Resist Parameters", SPIE Microlithography Conference, Santa Clara, CA, (1997).
  139. "Photoresist Characterization for Lithography Simulation Part 3: Development Parameter Measurements", SPIE Microlithography Conference, Santa, CA, (1997).
  140. "Photoresist Characterization for Lithography Simulation Part 2: Exposure Parameter Measurements", SPIE Microlithography Conference, Santa Clara , CA, (1997).
  141. “Advanced Photoresist Characterization and Modeling", SRC Lithography Review, Berkeley, CA, (1996).
  142. “Modeling the Lithographic Process I: Equipment Design and Modeling Analysis for a Series of Commercial I-Line Resists", SRC TECHCON’96, Phoenix, AZ, (1996).
  143. "Factors Affecting the Dissolution Rate of Novolac Resins II: Developer Composition Effects", SPIE Microlithography Conference, Santa Clara, CA, (1996).

 

 

E.  Other Scholarly Accomplishments

 

Patents

1.  Yamanaka, Kazuhiro; Romeo, Michael; Henderson, Clifford; Maeda, Kazuhiko.   Photosensitive polyimide composition and polyimide precursor composition for photoresist lower temperature lithographic patterning.    PCT Int. Appl.  (2007),     70pp.

2.   King, William P.; Henderson, Clifford L..   Direct write nanolithography using heated nano-scale dimensioned probe tip.    PCT Int. Appl.  (2007),     20pp.

3.   Henderson, Clifford L.; Hoskins, Trevor; Berger, Cody M.   Compositions and Methods of Use Thereof.    U.S. Pat# 7,223,518 B2 (May 29, 2007).

4.   King, William P.; Henderson, Clifford L.; Rowland, Harry Dwight; White, Celesta E.   Patterning of sacrificial materials.    U.S. Pat. Appl. Publ.  (2005),     20 pp.

5.   Kohl, Paul A.; Allen, Sueann Bidstrup; Wu, Xiaoqun; Henderson, Clifford Lee.  Method of Use and Decomposition of Photodefinable Polymers.    U.S. Pat. Appl. Publ.  (2004),     28 pp.

6.   Kohl, Paul A.; Allen, Sueann Bidstrup; Henderson, Clifford Lee; Jayachandran, Joseph Paul; Reed, Hollie; White, Celesta E.  Sacrificial Compositions, Methods of Use, and Methods of Decomposition Thereof.  U.S. Pat.# 7,052,821 B2 (May 30, 2006)

7.   Kohl, Paul Albert; Allen, Sue Ann Bidstrup; Henderson, Clifford Lee; Reed, Hollie Anne; Bhusari, Dhananjay M.  Fabrication of Semiconductor Devices with Air Gaps for Ultralow Capacitance Interconnections and Methods of Making Same.  U.S. Pat.# 6,888,249B2 (May 3, 2005).

8.   Lee, Wai Mun; Maloney, David J.; Roman, Paul J.; Fury, Michael A.; Hill, Ross H.; Henderson, Clifford L.; Barstow, Sean. Method of and Apparatus for Substrate Pre-Treatment. U.S. Pat.# 6,696,363 B2 (Feb. 24, 2004).

9.   Kohl, Paul Albert; Allen, Sue Ann Bidstrup; Henderson, Clifford Lee; Reed, Hollie Anne; Bhusari, Dhananjay M.  Fabrication of Semiconductor Devices with Air Gaps for Ultralow Capacitance Interconnections and Methods of Making Same.  U.S. Pat.# 6,610,593 B2 (Aug. 26, 2003).